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Ball Bonder Machine – Latest Technology Of ULTRALUX Automatic Wire Bonder

The overall Ball Bonder Machine Market worldwide was valued at US$ 969.89 Mn in 2020 and is set to grow with a CAGR of 5.08% during the forecast period.

Major Players in the market includes Kulicke and Soffa (KandS), Micro Point Pro (MPP), KAIJO, ASM Pacific Technology, Ultrasonic Engineering, Shinkawa, Planar, FandK.

    Jun. 25, 2020-- Kulicke and Soffa Industries, Inc. (“Kulicke & Soffa”, “K&S” or “Company”), announced that it will be exhibiting at the SEMICON China 2020 trade show in Shanghai, China, from June 27 to 29. The new ULTRALUX automatic wire bonder along with the POWER-C wedge bonder will debut at the trade show. The ULTRALUX wire bonder utilizes the latest technologies and material which offers cost-of-ownership advantage, delivering high productivity and yield. Its quick LED suite ensures time to market optimization with quick bond, stitch and loop processes. K&S’s new POWER-C wedge bonder is built specifically for single-row TO package power devices. The bonder is engineered with a proven and powerful direct-drive motion system, bondhead, ultrasonic generator system and wire feeding mechanism. Its expanded pattern recognition capabilities deliver industry leading productivity and reliability. Other K&S solutions such as the RAPID Pro GEN-S series ball bonder, capillaries and dicing blades will also be showcased.

    Ball Bonder Machine Market segmented by Types, Manual Ball Bonder, Semi-Automatic Ball Bonder and Fully Automatic Ball Bonder. Market segmented by Applications, IDMs and OSAT. In terms of region, the global ball bonder machine market can be divided into North America, Europe, Asia Pacific, Middle East & Africa, and South America. North America dominated the global ball bonder machine market in 2020, due to presence of well-established and technologically advanced manufacturers in the region. The U.S. is a key market in North America, due to increasing production of electronics in the region.

 


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